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Patent Searching and Data

Document Type and Number:
Japanese Patent JPH01262692
Kind Code:

PURPOSE: To enable a printed wiring board to be bonded reliably with an electronic component sealed with resin or ceramics, by applying an adhesive tape on the surface of the electronic component on which an electronic component is to be bonded, for fixing the printed wiring board securely.

CONSTITUTION: A pair of external leads 2 are led out from one side of a molded resin body 1 while an external lead 2 is led out from the opposite side of the molded resin body 1. An adhesive tape 3 is applied to the bottom of the molded resin body 1 while remaining the margins of the four edges exposed. The adhesive tape 3 has such a thickness that the external bonding face of the tape 3 is flush with the bonding face of the external leads 2 or is projected slightly outwards therefrom. According to such arrangement, a printed circuit board can be packaged reliably only by peeling off a protective paper protecting the adhesive face of the adhesive tape and by pressing the adhesive tape on a predetermined place in the printed wiring board.

Application Number:
Publication Date:
October 19, 1989
Filing Date:
April 13, 1988
Export Citation:
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International Classes:
H05K1/18; H05K3/30; H05K3/34; (IPC1-7): H05K1/18