Title:
ELECTRODE STRUCTURE FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3145203
Kind Code:
B2
Abstract:
PURPOSE: To provide a highly reliable solder joint between printed wiring boards or between a printed wiring board and an electronic component.
CONSTITUTION: When a connecting electrode 11 of a printed wiring board 1 is jointed through a solder 3 to a terminal lead 2 of an IC, the connecting electrode 11 is shaped to have top surface 111 wider than the bottom surface 112 thus forming overhangs 113 at the opposite ends of the top surface 111. Solder 3 for jointing the terminal lead 2 wraps around the overhang 113 thus enhancing reliability of the joint.
Inventors:
Wada, Hiroshi
Wakiyama, Katsutoshi
Wakiyama, Katsutoshi
Application Number:
JP24943292A
Publication Date:
March 12, 2001
Filing Date:
September 18, 1992
Export Citation:
Assignee:
RICOH CO LTD
International Classes:
H05K3/34; H05K1/02; H05K3/40; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
瀧野 秀雄 （外２名）