ELECTROLESS GOLD PLATING SOLUTION

Title:

ELECTROLESS GOLD PLATING SOLUTION

Document Type and Number:

Japanese Patent JPH03294484

Kind Code:

A

Abstract:

PURPOSE: To prepare an electroless gold plating soln. stable to impurity metal ions by adding aminophosphonic acids to an electroless gold plating soln. contg. Au ions, a complexing agent for Au ions and a reducing agent.

CONSTITUTION: At least one of aminophosphonic acids such as aminomethylphosphonic acid, iminophosphonic acids such as ethylenediiminobisisopropylphosphonic acid or the sodium, potassium or ammonium salts of the acids is added to an electroless gold plating soln. in about 1-20 molar ratio to ions of impurity metals such as Cu, Ni and Fe. The plating soln. contains Au ions, a complexing agent for Au ions such as thiosulfuric acid and a reducing agent such as sodium hypophosphite. The decomposition of the plating soln. due to impurity metal ions is prevented and the stability is remarkably improved.

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Inventors:

OKUDAIRA HIROAKI
ANDO SETSUO
KASHIMURA TAKASHI
MURAYAMA NOBUYASU
SHIMAZAKI TAKESHI
TOMIZAWA AKIRA

Application Number:

JP9646190A

Publication Date:

December 25, 1991

Filing Date:

April 13, 1990

Export Citation:

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Assignee:

HITACHI LTD
HITACHI CHEMICAL CO LTD

International Classes:

C23C18/44; (IPC1-7): C23C18/44

Domestic Patent References:

JPS503742A	1975-01-16
JPS63137178A	1988-06-09

Attorney, Agent or Firm:

Katsuo Ogawa (1 person outside)

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