Title:
ELECTROMAGNETIC WAVE SHIELD MATERIAL, ELECTROMAGNETIC WAVE SHIELD HOUSING, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021111704
Kind Code:
A
Abstract:
To provide an electromagnetic wave shield material, an electromagnetic wave shield housing, and a manufacturing method thereof in which an inexpensive resin film such as a PET resin film can be used and the moldability does not easily deteriorate during warm processing.SOLUTION: An electromagnetic wave shield material 10 includes a metal foil 11, a resin film 12, and an adhesive layer 13 provided between the metal foil 11 and the resin film 12. In the electromagnetic wave shield material 10, the adhesive layer 13 includes a heat-resistant filler 14.SELECTED DRAWING: Figure 1
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Inventors:
YAMAMOTO YUKITOMO
IMAMURA HIRONORI
IMAMURA HIRONORI
Application Number:
JP2020003085A
Publication Date:
August 02, 2021
Filing Date:
January 10, 2020
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
H05K9/00; B29C45/14; B32B15/08; C09J11/02; C09J11/04; C09J201/00
Attorney, Agent or Firm:
Axis International Patent Business Corporation