To enable application to a plasma display or the like, by bonding and transferring a mesh-shaped metalized layer which is electrodeposited, in a mesh shape, on a metalized board by using metal electrolytic solution, on a transparent board surface for electromagnetic wave shielding via adhesive agent, and obtaining electromagnetic wave shielding property and transparency.

A metalized board 14 having an insulating film 12 is dipped in metal electrolytic solution for electromagnetic wave shielding, and a mesh- shaped metalized layer 3 is electrodeposited to have a desired thickness on a part corresponding to an electrodeposition part of the metalized board 14. A transparent board 2 for electromagnetic wave shielding is overlapped on the surface of the mesh-shaped metalized layer 3 surface, both of them are fitted by pressure, and the mesh-shaped metalized layer 3 is bonded and transferred on the surface of the transparent board 2 for electromagnetic wave shielding. After that, the transparent board 2 for electromagnetic wave shielding which has the bonded and transferred mesh-shaped metalized layer 3 is exfoliated from the metalized board 14, and an electromagnetic wage shielding plate having electromagnetic wave shielding property and transparency is manufactured.