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Title:
ELECTROMAGNETIC WAVE SHIELD PLATE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH1126980
Kind Code:
A
Abstract:

To enable application to a plasma display or the like, by bonding and transferring a mesh-shaped metalized layer which is electrodeposited, in a mesh shape, on a metalized board by using metal electrolytic solution, on a transparent board surface for electromagnetic wave shielding via adhesive agent, and obtaining electromagnetic wave shielding property and transparency.

A metalized board 14 having an insulating film 12 is dipped in metal electrolytic solution for electromagnetic wave shielding, and a mesh- shaped metalized layer 3 is electrodeposited to have a desired thickness on a part corresponding to an electrodeposition part of the metalized board 14. A transparent board 2 for electromagnetic wave shielding is overlapped on the surface of the mesh-shaped metalized layer 3 surface, both of them are fitted by pressure, and the mesh-shaped metalized layer 3 is bonded and transferred on the surface of the transparent board 2 for electromagnetic wave shielding. After that, the transparent board 2 for electromagnetic wave shielding which has the bonded and transferred mesh-shaped metalized layer 3 is exfoliated from the metalized board 14, and an electromagnetic wage shielding plate having electromagnetic wave shielding property and transparency is manufactured.


Inventors:
HANAOKA KOKICHI
TAMEGAI KIYOSHI
SEKINE HIROYUKI
Application Number:
JP1997000193405
Publication Date:
May 19, 1989
Filing Date:
July 04, 1997
Export Citation:
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Assignee:
SEKINE KK
International Classes:
A63B22/06; A63B22/02; A63B23/04; A63B24/00; A63B26/00; (IPC1-7): A63B23/06
Attorney, Agent or Firm:
小西 淳美



 
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