Title:
ELECTRONIC COMPONENT MOUNTING METHOD
Document Type and Number:
Japanese Patent JP3043492
Kind Code:
B2
Abstract:
PURPOSE: To enable electronic components to be mounted high in density without stopping a machine by a method wherein a mounting program is divided into groups where mounting sequence limitations are not applied if electronic components have mounting sequence limitations, and the mounting operation of components in a following group is not executed until the mounting operation of all components in a current group is not finished.
CONSTITUTION: An electronic component indicated by a mounting program is taken out from a component feed means by a suction nozzle 1, and the component is checked in suction state by a detector 4. The electronic component is thrown away when it is abnormal in suction state or mounted on a circuit board 11 when it is found normal. Then, it is judged that the block number of a following step in a mounting program is equal to that of a current step, and a suction operation is carried out when it is found that the both numbers are equal to each other, and a new component is mounted again replacing the rejected component when the both numbers are not equal. By this setup, a suction nozzle 1 is able to carry out the mounting operation of an electronic component without interfering with an electronic component mounted on the circuit board 11.
Inventors:
Akira Mohri
Shigeki Imafuku
Ken Takeda
Masao Iriya
Shigeki Imafuku
Ken Takeda
Masao Iriya
Application Number:
JP28775991A
Publication Date:
May 22, 2000
Filing Date:
November 01, 1991
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23P21/00; G06T1/00; H05K13/00; H05K13/04; H05K13/08; (IPC1-7): H05K13/04
Domestic Patent References:
| JP63307799A | ||||
| JP1161800A |
Attorney, Agent or Firm:
Masaru Ishihara