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Patent Searching and Data


Title:
ELECTRONIC COMPONENT PACKAGING METHOD
Document Type and Number:
Japanese Patent JP2009277920
Kind Code:
A
Abstract:

To ensure high packaging quality by continuously stabilizing a pressing load even in long-time pressing.

A VCM 3 is brought into a pressed state under current control, a servo motor 6 is controlled in position, a nozzle 1 is moved down to a mounting position, and it is confirmed that an electronic component P is abutted to a circuit board S. Further, the electronic component P is moved down just by a predetermined push-in amount, the VCM 3 is switched from current control to load feedback control and raised to an initial achievement load P1 for an optional time T0 and after the lapse of an optional time T1 during which the load P1 is stabilized, the load feedback control is switched to current control for pressing load just for a predetermined time. After the lapse of the optional time T1 within which the load P1 is stabilized, the load feedback control is not performed but switched to the current control, thereby suppressing drift without being affected by instability in pressing load with the passage of time. A generation rate of a junction defect can be reduced by the load stabilization.


Inventors:
HOSOYA NAOTO
KAWAI TAMOTSU
Application Number:
JP2008128288A
Publication Date:
November 26, 2009
Filing Date:
May 15, 2008
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
H05K13/04
Attorney, Agent or Firm:
Mitsutake Murayama