Title:
ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH05259355
Kind Code:
A
Abstract:
PURPOSE: To change the shape of a chip component to smoothen a solder flow during transfer while a conductive zone of a chip component and a wiring pattern of a printed wiring board are bathed with molten solder in the step of soldering the conductive zone to the wiring pattern.
CONSTITUTION: A main body 21 of a chip component where leads 22 project out of both counter side faces of the main body 21 is formed in the surface which is bathed with molten solder as a gentle curve.
Inventors:
Toru Ogasawara
Application Number:
JP5578692A
Publication Date:
October 08, 1993
Filing Date:
March 16, 1992
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L23/50; H01R4/02; H05K1/18; H05K3/34; (IPC1-7): H01L23/50; H01R4/02
Attorney, Agent or Firm:
Iwao Yamaguchi
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