Title:
ELECTRONIC COOLING DEVICE
Document Type and Number:
Japanese Patent JP3638256
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic cooling device to be excellent in cooling performance and manufacturing ability.
SOLUTION: A thermoelectric module consisting of a Peltier element is situated at a protrusion part 15a of a module base 15 formed of aluminum being high in thermal conductivity. A heat absorbing fin 2 serving as a heat absorber on the low temperature side and a protrusion part 15a of the module base 15 are fastened, and a radiating fin 3 serving as a radiator on the high temperature side is fastened by plate parts 15b and 15c of the module base 15.
Inventors:
Hideaki Okuda
Akira Takushima
Akira Takushima
Application Number:
JP2001109509A
Publication Date:
April 13, 2005
Filing Date:
December 28, 1994
Export Citation:
Assignee:
Sharp Corporation
International Classes:
G02F1/13; F25B21/02; G03B21/16; H01L35/30; (IPC1-7): G03B21/16; F25B21/02; G02F1/13; H01L35/30
Domestic Patent References:
| JP6002337U |
Attorney, Agent or Firm:
Keiichiro Saikyo
Takaya Koike
Masaharu Kinoshita
Takaya Koike
Masaharu Kinoshita
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