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Title:
ELECTRONIC COOLING PANEL
Document Type and Number:
Japanese Patent JPH04199858
Kind Code:
A
Abstract:

PURPOSE: To cool the cooling face to low temperature even under the condition of use where heat radiation efficiency is small on the side of heat radiation by constituting a semiconductor element out of the carrier particles in the shape of porous substances and the thermoelectric semiconductive layers made at the surfaces.

CONSTITUTION: A semiconductor element comprises the carrier particles in the shapes of porous substances and the thermoelectric semiconductive layer made at the surfaces. As these carrier particles, glass balloons (hollow glass particles) 11 are used. Though these balloons 11 are of hollow structure, the insides and the outsides are not airtight and the glass itself is a porous substance. And thermoelectric conductor layers 12 are made at the surfaces of the glass balloons 11. Hereby, the lowermost reach temperature on the low temperature side can be lowered under the condition that the heat radiation is small, and also the area enlargement is easy and it can be manufactured cheaply.


Inventors:
YOKOYA YOICHIRO
ANDO HAMAE
KUGIMIYA KOICHI
Application Number:
JP1990000335911
Publication Date:
July 21, 1992
Filing Date:
November 29, 1990
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/38; H01L35/16; H01L35/32; (IPC1-7): H01L23/38; H01L35/32