Title:
ELECTRONIC DEVICE AND PRODUCTION METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2014221526
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To seal a junction between a first molded body composed of a thermosetting resin and a second molded body composed of a thermoplastic resin without applying a sealant thereto after molding the second molded body.SOLUTION: In a production method of an electronic device, initially a first molded body 13 is molded by curing a thermosetting resin in a state in which a resin sheet 40 is fixed to an inner face of a mold, and the resin sheet 40 is bonded to a face to be joined of the first molded body 13 (the first molding step), and subsequently a second molded body 20 is molded in a state in which the resin sheet 40 is interposed between a resin for molding of the second molded body 20 and the first molded body 13, and the resin sheet 40 is integrated with the second molded body 20 by fusing a portion 40a on the surface side of the resin sheet 40 by heat of molding (the second molding step).
Inventors:
IKUNO YUICHI
IZUMI RYUSUKE
HARADA TOMOYUKI
IZUMI RYUSUKE
HARADA TOMOYUKI
Application Number:
JP2013101526A
Publication Date:
November 27, 2014
Filing Date:
May 13, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
B29C69/00
Attorney, Agent or Firm:
Patent business corporation ゆうあい patent firm