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Title:
ELECTROSPRAY DEPOSITION DEVICE AND PARTIAL FILM FORMING METHOD
Document Type and Number:
Japanese Patent JP2011175921
Kind Code:
A
Abstract:

To carry out a partial deposition of a desired material at a desired position on a substrate at a high precision so as to repair patterning in an organic EL element or the like.

The electrospray deposition device (ESD) includes a nozzle 11 accommodating a solution of a desired material, a spraying power source 32 for applying a voltage on the nozzle, a converging guard ring 15 for converging a spray range of droplets sprayed from the nozzle, a guard ring power source 36 for applying a voltage or a current on the converging guard ring 15, a partial electrode 21 located at a substrate rear surface side at a depositing position on a substrate 20, and a partial electrode power source 41 for applying to the partial electrode 21 a voltage of a reverse polarity of the voltage applied on the nozzle. As the converging guard ring 15, an electrostatic lens 50 or an assembly of the electrostatic lens 50 and an electromagnetic lens 51 are used.


Inventors:
ISHIZUKA TOSHIOMI
WATANABE SUSUMU
KATAOKA FUMIO
TANAKA JUN
Application Number:
JP2010040269A
Publication Date:
September 08, 2011
Filing Date:
February 25, 2010
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP
International Classes:
H05B33/10; H01L51/50
Attorney, Agent or Firm:
Polaire Patent Business Corporation