Title:
集積回路装置パッケージ用切り欠きヒート・スラグ
Document Type and Number:
Japanese Patent JP2007537589
Kind Code:
A
Abstract:
In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate having conductive traces and pad landings. The conductive traces have pad landings. An IC is mounted on the substrate. The IC has bonding pads. With conductive wires, the IC bonding pads are connected to the pad landings, which in turn, are connected to the conductive traces. A heat slug, having predetermined height, is disposed on the substrate surface. The heat slug includes a plurality of mounting feet providing mechanical attachment to the substrate. A cavity in the heat slug accommodates the IC. A plurality of first-size openings surrounds the IC. A second-size opening constructed from one of the first size-openings, is larger than the first-size opening. The second size-opening facilitates the introduction of molding compounds into the cavity of the heat slug.
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Inventors:
Xia-Shun, Shen
Guo-wen, pen
Care-Shen, Sea
Guo-wen, pen
Care-Shen, Sea
Application Number:
JP2007512693A
Publication Date:
December 20, 2007
Filing Date:
May 10, 2005
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
H01L23/29; H01L21/56; H01L23/12; H01L23/42
Domestic Patent References:
| JPH08139223A | 1996-05-31 | |||
| JPH11163229A | 1999-06-18 | |||
| JP2000151083A | 2000-05-30 | |||
| JP2002151633A | 2002-05-24 | |||
| JP2001102495A | 2001-04-13 | |||
| JPH03101038U | 1991-10-22 | |||
| JPH0613537A | 1994-01-21 | |||
| JPH07321246A | 1995-12-08 |
Foreign References:
| US7656029B2 | 2010-02-02 |
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki