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Title:
ENDLESS BAND SAW FOR CUTTING HARD MATERIAL
Document Type and Number:
Japanese Patent JPS61284317
Kind Code:
A
Abstract:

PURPOSE: To enable a band saw to highly accurately and efficiently cut an expensive hard material with no wastefulness, by providing abrasive grains of diamond or cubic crystal boron nitride or a sintered material containing these abrasive grains in one side end part of an endless steel belt formed by rolling a seamless steel pipe.

CONSTITUTION: A steel pipe 1 with no seam at all, being rolled, forms an endless steel belt 2 being used as a base metal of endless band saw decreasing the thickness. The endless steel belt 2, electrodepositing in its one side end part a diamond dust 3 to provide an edge part 4, forms notched parts in an equal space. The steel belt, using abrasive grains of cubic crystal boron nitride in place of the diamond dust 3, binds the abrasive grains to be attached by electroplating or electroless plating. Or a metallic dust sintered material or a resin powder sintered material, containing the abrasive grains of the diamond dust 3 or the cubic crystal boron nitride, is welded or brazed or adhesively attached. In this way, the endless band saw, having no seam at all with a uniform quality as a whole in larger strength further with a fine thickness of 0.5mm or less, can be easily manufactured.


Inventors:
MATSUDA YUSAKU
Application Number:
JP12497785A
Publication Date:
December 15, 1986
Filing Date:
June 07, 1985
Export Citation:
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Assignee:
SANWA DIAMOND KOGYO KK
International Classes:
B28D1/08; B23D61/12; B28D1/12; (IPC1-7): B23D61/12; B28D1/08
Domestic Patent References:
JPS60158902A1985-08-20
Attorney, Agent or Firm:
Sadaji Ishida (2 outside)