PURPOSE: To provide an epoxy resin compsn. which can provide a printed circuit board having low permittivity and dielectric dissipation factor without detriment to the heat resistance, etc., inherent in a conventional epoxy printed circuit board.
CONSTITUTION: The compsn. comprises an epoxy resin, an aryl ester compd. represented by the formula (wherein X and Y are each independently H or 1-20C acyl excluding the case when they are both H; 1. and R2 are each independently 1-10C alkyl. 1-10C alkoxy, 6-20C aryloxy, halogen, etc. ; f and g are each independently an integer of 1-3; h and i are each independently an integer of 0-4; and R3 is a direct bond, a 1-10C hydrocarbon group, sulfo, -S-, -C(=O)-, or -O-), and a cure accelerator. A copper-clad laminate is obtd. from a copper foil and a prepreg formed by impregnating a substrate with the compsn. followed by drying.
UEDA YOICHI
SHIBATA MITSUHIRO
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