Title:
EPOXY RESIN COMPOSITION, CURED MATERIAL AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH10158362
Kind Code:
A
Abstract:
To obtain the subject composition containing an epoxy compound derived from epibromohydrin compound and exhibiting excellent corrosion resistance, etc.
This composition contains a bromine-containing chlorine-free epoxy compound produced by glycidylating a hydroxy compound such as aliphatic hydroxy compound, alicyclic hydroxy compound or aromatic hydroxy compound with an epibromohydrin compound. The obtained composition contains decreased amount of chlorine as a corrosive impurity and is usable e.g. as an insulation material, especially for the sealing of various semiconductors, die bonding paste, etc.
Inventors:
KUBOKI KENICHI
OSHIMI KATSUHIKO
KAJIWARA YOSHITAKA
OSHIMI KATSUHIKO
KAJIWARA YOSHITAKA
Application Number:
JP33143996A
Publication Date:
June 16, 1998
Filing Date:
November 28, 1996
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08L63/00; C08G59/04; C08G59/30; C08G59/32; H01L21/52; H01L23/29; H01L23/31; (IPC1-7): C08G59/30; C08G59/04; C08G59/32; C08L63/00; H01L21/52; H01L23/29; H01L23/31