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Title:
EPOXY RESIN COMPOSITION FOR LAMINATED PLATE
Document Type and Number:
Japanese Patent JP2003292570
Kind Code:
A
Abstract:

To provide a thermosetting resin composition imparting a printed circuit board material excellent in dielectric properties, molding properties, heat resistance, etc., and to provide a laminated plate and printed-circuit board comprising the same.

The thermosetting resin composition comprises an epoxide of a polyphenylene ether oligomer having 700-3,000 of number average molecular weight and epoxy groups on both terminals, and a hardener and the laminated plate and the printed-circuit board using the same.


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Inventors:
ISHII KENJI
YAMAZAKI KATSUTOSHI
HIRAMATSU MASAO
MIYAMOTO MAKOTO
Application Number:
JP2002095752A
Publication Date:
October 15, 2003
Filing Date:
March 29, 2002
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08J5/24; C08G59/22; H05K1/03; (IPC1-7): C08G59/22; C08J5/24; H05K1/03
Attorney, Agent or Firm:
Takashi Nagai



 
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