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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP3323755
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain the subject composition capable of being molded and cured without depending on the content of absorbed moisture, capable of exhibiting excellent mold releasability, and capable of reducing the generation of inner voids by using a specific curing accelerator.
SOLUTION: This epoxy resin composition comprises (A) an epoxy resin such as a bisphenol type epoxy resin, (B) a curing agent such as a xylylene resin, (C) a curing accelerator comprising a compound of formula I [R is a 1-4C alkyl; X is p-benzoquinone; (m) is 1-3][e.g. tris(methylphenyl)phosphine.p- benzoquinone], and (D) a filler (e.g. an inorganic filler having an average particle diameter of 0.1-100μm), etc. The component C is preferably contained in an amount of 0.001-0.1 mole, preferably 0.005-0.03 mole, per 100 pts.wt. of the component A, and the component D is contained in an amount of 50-90vol.% based on the resin composition.


Inventors:
Kokado, Hiroyoshi
Eguchi, Kuniyuki
Ishii, Toshiaki
Hattori, Rie
Mogi, Akira
Koujima, Hirooki
Application Number:
JP24996696A
Publication Date:
September 09, 2002
Filing Date:
September 20, 1996
Export Citation:
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Assignee:
HITACHI LTD
HITACHI CHEM CO LTD
International Classes:
C08K7/00; C08G59/24; C08G59/40; C08G59/62; C08G59/68; C08K3/00; C08K7/18; C08L3/00; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/40; C08G59/68; C08K3/00; C08L63/00
Attorney, Agent or Firm:
小川 勝男 (外2名)