Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2963260
Kind Code:
B2
Abstract:
PURPOSE: To enable epoxy resin composition to be enhanced in soldering heat resistance at soldering without deteriorating it in moldability and reliability by a method wherein specific epoxy resin, specific phenolic resin hardening agent, inorganic filler, and hardening accelerator are made to serve as essential ingredients of epoxy resin composition.
CONSTITUTION: Epoxy resin which contains 30-100% copolycondensation novolac epoxy resin composed of O-cresol represented by a formula I and β-naphthol by weight out of total epoxy resin is made to serve as a first component. Hardening agent which contains 30-100% phenolic resin hardening agent represented by a formula II by weight out of total hardening agent is made to serve as a second component. In the formulas I and II, a letter n denotes 1-6. In the formula II, R1 and R2 denote the same or a different atom or a group selected from hydrogen, halogen, a low class alkyl Furthermore, inorganic filler and hardening group. as essential ingredients. By this setup, a resin composition excellent in heat resistance and flexibility and low in water absorption properties can be obtained.
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Inventors:
TOMOKUNI MASATOYO
Application Number:
JP32927791A
Publication Date:
October 18, 1999
Filing Date:
December 13, 1991
Export Citation:
Assignee:
SUMITOMO BEEKURAITO KK
International Classes:
C08G59/32; C08G59/20; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; C08G59/32; C08G59/62; C08L63/00; H01L23/31
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