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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH03244628
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition excellent in heat resistance and low hygroscopicity and especially useful as a sealing material for electronic components or a laminating material by mixing a specified epoxy compound with a specified polyhydric phenol and a specified dihydric phenol. CONSTITUTION:An epoxy resin composition is obtained by mixing an epoxy compound of the formula (wherein OG is a glycidyl ether group; R1 is H or CH3; R2 is H or 1-12 C alkyl; and R4 to R10 are each H, 1-12 C alkyl or halogen) with a polyhydric phenol obtained by condensing a phenol with a hydroxybenzaldenyde (e.g. o-cresol/p-hydroxybenzaldehyde condensate) and a dihydric phenol (e.g. bisphenol A). This composition is excellent in heat resistance and low hygroscopicity, can be extensively used for casting, molding, laminating, coating and adhesive materials and is especially useful as a sealing material for electronic components or a laminating material.

Inventors:
NAKAJIMA NOBUYUKI
SAITO NORIAKI
SAKAMOTO HIDE
IKUSHIMA TADASHI
KANEKAWA SHUICHI
Application Number:
JP4392990A
Publication Date:
October 31, 1991
Filing Date:
February 23, 1990
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
H01L23/29; C08G59/00; C08G59/62; C08L63/00; H01L23/31; (IPC1-7): C08G59/62; H01L23/29; H01L23/31