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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04130126
Kind Code:
A
Abstract:
PURPOSE:To obtain an epoxy resin composition excellent in moldability and mechanical strengths, low in permittivity and a coefficient of expansion and excellent in resistance to an SF3 decomposition gas by mixing an epoxy resin of a specified composition with an inorganic filler comprising an aluminum oxide/dolomite mixture. CONSTITUTION:An epoxy resin composition used for a supporting structure, a supporting insulator or the like of a superhigh-voltage voltage apparatuses in which an SF3 gas is used as an arc-shielding medium, comprising an epoxy resin (25 pts.wt. alicyclic epoxy resin, 55 pts.wt. bisphenol A epoxy resin and 20 pts.wt. modified alicyclic epoxy resin), an acid anhydride curing agent, an inorganic filler (35 pts.wt. alumina treated with a silane coupling agent and 15 pts.wt. dolomite) and a cure accelerator, wherein the inorganic filler is used in an amount of 46 vol.% based on the total composition.

Inventors:
MIYAGAWA HIROSHI
KURATA YASUYUKI
Application Number:
JP25270690A
Publication Date:
May 01, 1992
Filing Date:
September 21, 1990
Export Citation:
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Assignee:
MEIDENSHA ELECTRIC MFG CO LTD
International Classes:
C08G59/20; C08G59/00; C08G59/14; C08K13/02; C08L63/00; H01B3/40; H01F41/12; (IPC1-7): C08G59/14; C08G59/20; C08L63/00; H01B3/40; H01F41/12
Attorney, Agent or Firm:
Fujiya Shiga (1 person outside)