Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
EPOXY RESIN POWDER COMPOSITION
Document Type and Number:
Japanese Patent JPH03244626
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition excellent in the balance between an ability to spread over the surface of a solid and an ability to penetrate into its gaps and good in heat shock resistance and adhesion by mixing a specified mixed epoxy resin with a specified compound curing agent and a silica filler in a specified mixing ratio. CONSTITUTION:The title composition is obtained by mixing 100 pts. wt. mixed epoxy resin of an average epoxy equivalent of 800-2,000, comprising a mixture of a bisphenol A epoxy resin of an epoxy equivalent of 180-2,500 with a rubber- modified epoxy resin of an epoxy equivalent of 180-2,500, obtained by reacting the above resin with a carboxylated acrylonitrile/butadiene copolymer rubber with a compounded curing agent comprising 0.1-3.0 pts. wt. imidazoale compound, 2-5 pts. wt. dicyandiamide and 3-7 pts. wt. carboxylic acid dihydrazide compound and 50-100 pts. wt. filler comprising silica. This composition has excellent adhesion to the surface of a solid such as a metal and is desirable for an insulating powder coating material for electrical and electronic components, etc.

Inventors:
ONO KAZUYA
YASUDA AKIRA
KITAGAWA KATSUJI
Application Number:
JP4360390A
Publication Date:
October 31, 1991
Filing Date:
February 23, 1990
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SOMAR CORP
International Classes:
H01F41/12; C08G59/00; C08G59/14; C08G59/20; C08G59/22; C08G59/40; C08G59/50; C08G59/56; C08K3/36; C08L63/00; C09D163/00; H01B3/40; H02K15/12; (IPC1-7): C08G59/14; C08G59/20; C08G59/40; C08G59/50; H01B3/40; H01F41/12; H02K15/12