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Patent Searching and Data


Title:
ETCHING APPARATUS
Document Type and Number:
Japanese Patent JP2018073960
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an etching apparatus for etching a processed substrate, such as a glass substrate, while transporting, in which a thin processed substrate can be transported suitably.SOLUTION: An etching apparatus 10 jets an etchant for a glass substrate 24 being transported in a prescribed direction. The etching apparatus 10 includes multiple processing chambers coupled in the transport direction of the glass substrate 24, and a coupling section 42. The coupling section 42 has an opening for passing the glass substrate 24, provided to interconnect two adjoining processing chambers. Furthermore, a transport auxiliary roller 50 for supporting the glass substrate 24 from below is placed in the coupling section 42.SELECTED DRAWING: Figure 4

Inventors:
HATORI HIROTAKA
Application Number:
JP2016211152A
Publication Date:
May 10, 2018
Filing Date:
October 28, 2016
Export Citation:
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Assignee:
NSC KK
International Classes:
H01L21/306; B65G13/00; C03C15/00