Title:
拡張型同時多スポット撮像検査
Document Type and Number:
Japanese Patent JP4886706
Kind Code:
B2
Abstract:
A system and method for inspection is disclosed. The design includes focusing illumination beams of radiation at an optical axis to an array of illuminated elongated spots on the surface at oblique angle(s) of incidence to the surface, performing a linear scan along a linear axis, wherein the linear axis is offset from the optical axis by a not insubstantial angular quantity, and imaging scattered radiation from the spots onto an array of receivers so that each receiver in the array receives scattered radiation from a corresponding spot in the array of spots.
Inventors:
Beeruck stephen
Short david
Short david
Application Number:
JP2007558213A
Publication Date:
February 29, 2012
Filing Date:
March 01, 2006
Export Citation:
Assignee:
KLA-Tenker Corporation
International Classes:
G01N21/956; G01N21/84
Domestic Patent References:
| JP2002328099A | ||||
| JP6094641A | ||||
| JP11083753A |
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida
Jun Ishida