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Patent Searching and Data


Title:
FIBER BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008149551
Kind Code:
A
Abstract:

To provide a fiber board which can suppress the delamination of a fiber compression-molded article, a conventional problem, and has high strength and a method for producing the fiber board.

The fiber board has a plurality of layers in which fibers and a thermoplastic resin are mixed. A layer which is derived from a film containing a thermoplastic resin and fusion-bonded to adjacent layers is provided in at least one space between the layers.


Inventors:
NAKAHARA MAKOTO
TAKEDA HIROTAKA
Application Number:
JP2006339513A
Publication Date:
July 03, 2008
Filing Date:
December 18, 2006
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
B32B27/12; B27N3/04; B29C43/20; B32B5/02; D04H1/58; D06M17/00; B29K105/06