Title:
底取付け用フィルム状接着剤
Document Type and Number:
Japanese Patent JP4169166
Kind Code:
B2
Abstract:
A molded shoe assembly having an outer sole with a heat activatable adhesive coated on one surface and absorbed in the sole surface and a release liner above the adhesive surface. The adhesvie will reactivate at a temperature of between 115 and 125 degrees F.
Inventors:
Strickland, Barbara A.
Kelloac, James H
Brinzo, Vitere FD
Kelloac, James H
Brinzo, Vitere FD
Application Number:
JP53215598A
Publication Date:
October 22, 2008
Filing Date:
January 27, 1998
Export Citation:
Assignee:
Worthen Industries, Inc.
International Classes:
A43D25/06; A43B9/12; A43B13/02; A43D11/00; A43D86/00
Domestic Patent References:
| JP63119701A | ||||
| JP3005243U |
Foreign References:
| US3693269 | ||||
| US4973371 | ||||
| GB2187998A |
Attorney, Agent or Firm:
Masaki Yamakawa
Hiroro Kurokawa
Masayuki Konno
Osamu Nishiyama
Jiro Suzuki
Shigeki Yamakawa
Hiroro Kurokawa
Masayuki Konno
Osamu Nishiyama
Jiro Suzuki
Shigeki Yamakawa
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