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Patent Searching and Data


Title:
FILM DEPOSITION APPARATUS
Document Type and Number:
Japanese Patent JP2015218374
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress a film deposition apparatus, equipped with a sputtering cathode unit which presses a bonding pad where a sputtering target is bonded against a cooling part with a clamp, from decreasing in cooling efficiency.SOLUTION: A film deposition apparatus is equipped with a clamp part 15 which presses a bonding part 13 against a cooling part 14, and the clamp part 15 has a press part 15b which comes into contact with a top 13c of the bonding part 13 inside an end face 13f of the bonding part 13. A gap is formed between a contact position of the press part 15b and an end face 13f of the bonding part 13, and the press part 15 and bonding part 13 are brought into contact with each other at a position closer to a target 11. Consequently, adhesion between the bonding part 13 and cooling part 14 is improved nearby the target 11 so as to suppress a decrease in cooling efficiency.

Inventors:
MORI MASAFUMI
IWATA HIROSHI
Application Number:
JP2014104482A
Publication Date:
December 07, 2015
Filing Date:
May 20, 2014
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
C23C14/34
Attorney, Agent or Firm:
長谷川 芳樹
黒木 義樹
柳 康樹