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Patent Searching and Data


Title:
FILM MAKING APPARATUS
Document Type and Number:
Japanese Patent JP2000202351
Kind Code:
A
Abstract:

To make a flat coating film on a substrate without increasing film making costs by supplying a film making coating liquid on the substrate held by a substrate holding means and storing the coating liquid supplied on the substrate in a film shape by a frame member mounted on the substrate.

A semiconductor device substrate A set in a film making apparatus is conveyed onto a turntable 1 in a film making chamber by a conveyance unit and fixed by a vacuum chuck, and the like. Next, the periphery of the substrate A is clamped by a frame member (clamp ring) 3 supported by a frame support 4 through a shock absorber 5. After that, a film making coating liquid is dropped from a coating liquid supply nozzle 2 in a liquid storage area Aa on the clamped substrate A, and the coating liquid is retained in the area Aa and smoothed. After that, the frame member 3 is covered by a vacuum device 6 having an outside air intake hole 7, the solvent of the coating liquid is sucked/ removed to form a desired coating film.


Inventors:
ISHIKAWA YOSHIMITSU
Application Number:
JP1999000011200
Publication Date:
July 25, 2000
Filing Date:
January 19, 1999
Export Citation:
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Assignee:
SONY CORP
International Classes:
B05D1/40; B01J19/00; B05C11/08; G03F7/16; H01L21/027; H01L21/316; (IPC1-7): B05C11/08; B05D1/40; G03F7/16; H01L21/027; H01L21/316
Attorney, Agent or Firm:
田治米 登 (外1名)