Title:
FILM, AND METHOD OF MANUFACTURING FILM
Document Type and Number:
Japanese Patent JP2020036007
Kind Code:
A
Abstract:
To provide a film suitable as a base material for a semiconductor manufacturing process, having: such a degree of heat resistance that the film heated to high temperature in a heating step can be handled without being closely adhered to an apparatus surface; and flexibility and uniform stretchability enough to be used as a tacky adhesive film for dicing.SOLUTION: The film is provided that has a maximum value Taof a 5% elongation stress at 25°C of 1.0 MPa or more and 20.0 MPa or less and has at least one α plane when the α plane denotes a surface having a skewness (Ssk) of -1.0 or more and 10.0 or less.SELECTED DRAWING: None
Inventors:
SHOJI HIDEO
TANAKA TERUYA
GODA WATARU
TANAKA TERUYA
GODA WATARU
Application Number:
JP2019151178A
Publication Date:
March 05, 2020
Filing Date:
August 21, 2019
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
H01L21/301; B29D7/01