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Patent Searching and Data


Title:
FLAW REPAIRING METHOD FOR MATERIAL TO BE GROUND AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP2000117612
Kind Code:
A
Abstract:

To sharply improve flaw repairing accuracy.

In automatic flaw repairing time for directly marking the flaw information of a flaw inspection result on the surface of a material 2 to be ground to repair the flaw, the slid quantity of the material 2 chucked to a material 2 rotating device 11 is directly detected at the time of grinding for repairing the flaw. The relative position with a grinding wheel in X and Y directions is changed based on the slid quantity while rotating the material 2, to coincide the flaw occurring position of the material 2 with a flaw information reading position, then repairing the flaw. Consequently a left flaw due to non-grinding or grinding to an unnecessary portion due to erroneous grinding can be prevented to sharply improve flaw repairing accuracy.


Inventors:
NAKATANI TETSUO
KOIKE YUKIMITSU
Application Number:
JP1998000295153
Publication Date:
April 25, 2000
Filing Date:
October 16, 1998
Export Citation:
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Assignee:
SUMITOMO METAL IND
International Classes:
B24B49/12; B24B27/033; (IPC1-7): B24B27/033; B24B49/12
Attorney, Agent or Firm:
溝上 満好 (外1名)