Title:
FLEXIBLE CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2591599
Kind Code:
B2
Abstract:
PURPOSE: To obtain a polyimide film-copper foil laminate, capable of carrying out the bonding of the polyimide film to a copper foil in a short time and excellent in the initial adhesive strength and solder heat resistance.
CONSTITUTION: (1) This flexible circuit board is obtained by laminating a copper foil circuit 3 onto a polyimide film substrate 1 and laminating a polyimide film cover lay film 5 on the copper foil circuit 3. Bonding layers among the copper foil circuit 3, the polyimide film substrate 1 and the cover lay film 5 are a bonding resin composition consisting essentially of (A) a graft copolymer prepared by carrying out the graft copolymerization of an unsaturated monomer containing an alkoxysilane group onto an ethylene-ethyl acrylate copolymer and (B) a polyvalent unsaturated monomer. The bonding layers are irradiated with ionizing radiation. (2) The bonding resin composition further contains (C) a flame retardant. Since the bonding resin composition is used, the flexible circuit board, a tape electric wire, etc., excellent in peel strength, solder heat and solvent resistances and electrical characteristics can be produced in a short time.
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Inventors:
HAYAMI HIROSHI
Application Number:
JP6154295A
Publication Date:
March 19, 1997
Filing Date:
February 27, 1995
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C09J4/00; C09J4/02; C09J133/04; C09J133/08; C09J151/00; C09J151/06; H05K3/38; (IPC1-7): C09J151/06; C09J4/00; H05K3/38
Attorney, Agent or Firm:
Minoru Ito (1 person outside)