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Patent Searching and Data


Title:
FLOOR COOLING AND HEATING PANEL
Document Type and Number:
Japanese Patent JP2012145317
Kind Code:
A
Abstract:

To provide a floor cooling and heating panel that has a function as a floor while improving a cooling and heating efficiency in a short time.

The floor cooling and heating panel 1 comprises: joining by an electric welding, the outer edge joining part 2a of an upper planar plate 2 and that part 3a of a lower plate 3 in such a state as to arrange to house a base 4 for making a fluid to flow in or out between the upper planar plate 2 being a floor face and a lower plate 3 with a formed groove 9 having a function preventing deformation due to expansion; joining by the electric welding, the joining part 2b of the upper planar plate 2 contacting the base 4 and a peripheral part 4c, and the joining part 3c of the lower plate 3 contacting the base 4 and the peripheral part 4c; and joining by the electric welding to the base, a male thread type flange 5 which has a spring 7 for preventing thread loosing to a panel-connecting two-stage male thread structure, and a female thread type flange of a two-stage female thread structure connecting thereto, respectively. Thereby, heat is efficiently conducted and the whole of the panel is evenly, uniformly warmed, thus improving space heating efficiency.


Inventors:
SHIMOTE TOSHIYUKI
Application Number:
JP2011000027810
Publication Date:
August 02, 2012
Filing Date:
January 13, 2011
Export Citation:
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Assignee:
IZUMI & CO LTD
International Classes:
F24D3/16; E04F15/18; F24F5/00