FORMATION OF METALLIC FILM AND METALLIC FILM FOR WIRING

Title:

FORMATION OF METALLIC FILM AND METALLIC FILM FOR WIRING

Document Type and Number:

Japanese Patent JPH0826889

Kind Code:

A

Abstract:

PURPOSE: To obtain a metallic film raised in the adhesiveness to a substrate without increasing the number of processes the decline in the electrical conductivity thereof and suppress to a minimum.

CONSTITUTION: The metallic film formation by vapor growth is started in an atmosphere of an oxygen-mixed state, and the amount of oxygen to be mixed is gradually reduced while continuing the metallic film formation, and even after stopping an oxygen mixing, the metallic film formation by vapor growth is continued until the film thickness reaches a specified level.

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Inventors:

KAWANO HIROYASU
SASAKI MAKOTO
YAGI TOMOHISA

Application Number:

JP16352394A

Publication Date:

January 30, 1996

Filing Date:

July 15, 1994

Export Citation:

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Assignee:

FUJITSU LTD

International Classes:

C30B25/16; C23C14/08; C23C14/34; C23C16/40; C23C16/44; C23C16/455; H05K3/38; H05K9/00; (IPC1-7): C30B25/16; C23C14/08; C23C14/34; C23C16/40; C23C16/44; H05K3/38; H05K9/00

Attorney, Agent or Firm:

Kubo Yukio

Next Patent: 横置型軸受装置