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Title:
FORMING METHOD OF COATING FILM TO POROUS SUBSTRATE
Document Type and Number:
Japanese Patent JP2007021421
Kind Code:
A
Abstract:

To provide a forming method of a coating film to the surface of a porous substrate having no problem from an aspect of production such as strike-through or the stop of production and capable of obtaining the coating film such as desired printing or a protective film.

The forming method of the coating film to the surface of the porous substrate 11 is composed of a process (1) for forming a non-porous layer 13 to one side of the porous substrate 11, a process (2) for forming the coating film 15 to the other side of the porous substrate 11 from a liquid composition by a coating method and/or a printing method and a process (3) for peeling and removing the non-porous layer 13 after the coating film 15 is formed. The forming method of the non-porous layer 13 is preferably a dry lamination method using an adhesive in an amount of 0.5-10 g/m2 or an extrusion coating method using no anchor coat.


Inventors:
OGAWA MASAHIKO
Application Number:
JP2005209337A
Publication Date:
February 01, 2007
Filing Date:
July 20, 2005
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B05D7/00; B05D3/12
Domestic Patent References:
JPH106448A1998-01-13
JPH11309796A1999-11-09
Attorney, Agent or Firm:
Satoshi Kanayama