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Title:
GAS LEAK TEMPORARY SEALING METHOD
Document Type and Number:
Japanese Patent JP2010181026
Kind Code:
A
Abstract:

To temporarily seal a gas leak aperture simply and rapidly which is formed in a gas flow pipe for making gas or the like flow.

This gas leak temporary sealing method for temporarily sealing the leak of gas G by sealing the gas leak aperture 2 formed in the gas flow pipe 1 in which the gas G flows includes a step of attaching a gas leak temporary sealing member 10 on the external surface of the gas flow pipe. The gas leak temporary sealing member includes on one surface thereof: a gas leak temporary sealing member adhesion material layer 12 containing unvulcanized butyl rubber; and, on the other surface thereof, a gas leak temporary sealing shape retention layer 11 retaining the shape of the gas leak temporary sealing member adhesion material layer 12. The gas leak temporary sealing member adhesion material layer 12 is adhered to the external surface 1a of the gas flow pipe 1 to face the gas leak aperture 2 so that an adhesion force for making the gas leak temporary sealing member adhesion material layer 12 adhere to the external surface 1a of the gas flow pipe 1 becomes larger than gas pressure from the inside of the gas leak aperture 2 to the outside thereof.


Inventors:
OKAMOTO HIDEKI
HARAGUCHI YASUAKI
Application Number:
JP2009063373A
Publication Date:
August 19, 2010
Filing Date:
March 16, 2009
Export Citation:
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Assignee:
OSAKA GAS CO LTD
DAITO KOKI KK
International Classes:
F16L55/16; F16B47/00
Domestic Patent References:
JP2001056087A2001-02-27
JPH10332073A1998-12-15
JP2007024283A2007-02-01
JPS639798A1988-01-16
JP2007030312A2007-02-08
JP2000146078A2000-05-26
JP2007046288A2007-02-22
JPH1047583A1998-02-20
JPS6349087U1988-04-02
Attorney, Agent or Firm:
Shuichiro Kitamura