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Patent Searching and Data


Title:
GRINDING DEVICE
Document Type and Number:
Japanese Patent JP2017140661
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a grinding device that maintains posture of a grind stone in grinding parallel relative to a wafer to perform high quality grinding of a wafer.SOLUTION: The grinding device 1 includes: grinding means 2 for grinding a wafer W; a wafer chuck 3 adjusted to be rotatable while holding the wafer W; and feeding means 4 supporting the grinding means 2 in a cantilever manner and feeding the grinding means 2 toward the wafer W. A grinding region A1 where the grinding means 2 grinds the wafer W is formed in a circular arc shape while striding a yaw axis Y1 that passes through the center of the grind stone 21 in plan view.SELECTED DRAWING: Figure 4

Inventors:
TOBIYAMA HIROTSUGU
Application Number:
JP2016022244A
Publication Date:
August 17, 2017
Filing Date:
February 08, 2016
Export Citation:
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Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24B41/06; B24B7/04; H01L21/304
Attorney, Agent or Firm:
Takayoshi Hayashi
Takamitsu Shimizu