Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
研削装置
Document Type and Number:
Japanese Patent JP6612574
Kind Code:
B2
More Like This:
JP2000107995GRINDING METHOD AND DEVICE FOR HARD DISK SUBSTRATE
JPH06755METHOD AND DEVICE FOR GRINDING INSIDE AND OUTSIDE SURFACES OF ANNULAR WORK
JPS6028628【発明の名称】一体型複列円錐ころ軸受外輪の加工方法
Inventors:
Mototaka Noma
Takashi Okamoto
Application Number:
JP2015192667A
Publication Date:
November 27, 2019
Filing Date:
September 30, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Toyo Advanced Technologies Co., Ltd.
International Classes:
B24B5/12; B24B41/06
Domestic Patent References:
JP4125556U
JP6000755A
JP2011073082A
JP2008307619A
Foreign References:
DD256611A1
US2909009
Attorney, Agent or Firm:
Maeda patent office



 
Previous Patent: 太陽電池パネル筐体及び給水栓自動開閉装置

Next Patent: 除湿方法及び除湿装置