To provide a grinding method for a workpiece and a machining device therefor capable of suppressing generation of chattering vibration relatively easily without giving influence on the processing efficiency or accuracy.
The grinding method is to process the workpiece W with the cylindrical surface of a whetstone 30 or its end face through such procedures that the workpiece W is rotated round its rotational axis, and the whetstone 30 approximately in a cylindrically shape is rotated round the whetstone rotational axis parallel with the workpiece rotational axis and advanced and retreated relative to the workpiece W in the direction perpendicularly intersecting the workpiece rotational axis, or that the whetstone 30 is moved relative to the workpiece W in the direction parallel to the workpiece rotational axis, wherein an oscillating signal G20 including a plurality of frequency components is superposed on a drive signal to a workpiece rotating means 21, and grinding is performed while the rotating speed of the workpiece W is changed at minor intervals.
YONEZU HISAHIRO
NONOYAMA MAKOTO
JPH088216A | 1996-01-12 | |||
JPH0911084A | 1997-01-14 | |||
JPH1177532A | 1999-03-23 | |||
JPS49135295A | 1974-12-26 | |||
JPS5256468A | 1977-05-09 | |||
JPS4926879A | 1974-03-09 | |||
JP2007044852A | 2007-02-22 |
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