Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
GROUND REINFORCING STRUCTURE
Document Type and Number:
Japanese Patent JP2009293365
Kind Code:
A
Abstract:

To provide a ground reinforcing structure capable of reducing horizontal pressures to the wall surfaces of various wall sections by the elastic characteristics of fractured tire rubber chips (tire shreds) cutting and fracturing a waste tire in slices.

In the ground reinforcing structure, a backfilling material 1 is formed to the wall surface of a wall section A by using a fractured rubber chip layer 2, and the periphery of the backfilling material 1 is compacted by the backfilling material 4. It is preferable that the backfilling material 1 is formed by laminating a covering layer 3 on the fractured rubber chip layer 2. It is preferable that the fractured rubber chip layer 2 and a soil layer 3 are laminated alternately. A surface brought into contact with the backfilling material 4 in the backfilling material 1 can be formed in a slant shape.


Inventors:
ASHOKA KUMAR KARMOKAR
Application Number:
JP2008250681A
Publication Date:
December 17, 2009
Filing Date:
September 29, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
BRIDGESTONE CORP
International Classes:
E02D17/18; E02B3/12; E02D29/02; E02D31/08
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Toshiharu Mori



 
Previous Patent: DECORATIVE PLATE

Next Patent: INSECT SCREENING TOOL