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Patent Searching and Data


Title:
GROUNDING SHEET
Document Type and Number:
Japanese Patent JP2003151653
Kind Code:
A
Abstract:

To provide a grounding sheet easy to work and high in reliability, for protecting a grounding body buried underground and reducing the grounding resistance.

A connection portion of a twisted bare copper wire 1 as a grounding body and a grounding wire 3 are covered with two conductive sheets 11A, 11B made by, for example, mixing acetylene black of conductive material into polyolefin as material and forming 1 mm thick and 30 cm wide. One of ends of the conductive sheets 11A, 11B overlapped with each other are sandwiched by a pinching and gripping member 12 made of plastic, and the other ends are fastened by fasteners 13A, 13B made of plastic. The grounding body is buried underground, and the twisted bare copper wire 1 and equipment to be grounded are connected with the grounding wire 3.


Inventors:
ISHIZAKI MAKOTO
Application Number:
JP2001000345346
Publication Date:
May 23, 2003
Filing Date:
November 09, 2001
Export Citation:
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Assignee:
SANKOSHA CO LTD
International Classes:
H01R4/66; H01B1/24; H02G1/14; H02G13/00; H02G15/08; (IPC1-7): H01R4/66; H01B1/24; H02G1/14; H02G13/00; H02G15/08
Domestic Patent References:
JPS5091030U1975-08-01
JPH0330728U1991-03-26
JPH02110939U1990-09-05
JPH0591139U1993-12-10
JPS419069Y11966-04-30
JP145855C
JPS5716172U1982-01-27
JPS56167475U1981-12-11
Attorney, Agent or Firm:
柿本 恭成