Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HARD MASK-FORMING COMPOSITION AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2021071660
Kind Code:
A
Abstract:
To provide a hard mask-forming composition excellent in low outgassing properties and crack resistance, and a method of manufacturing an electronic component using the hard mask-forming composition.SOLUTION: The hard mask-forming composition for forming a hard mask to be used in lithography contains a resin (P1) having a constituent unit (u11) represented by general formula (u11-1) and a resin (P2) containing an aromatic ring and a polar group (excluding the resin (P1)). In the formula (u11-1), R11 is an optionally substituted aromatic hydrocarbon group; and Rp11 is an aldehyde group, a group represented by formula (u-r-1), a group represented by formula (u-r-2) or a group represented by formula (u-r-3).SELECTED DRAWING: None

Inventors:
TSUCHIYA JUNICHI
KINUHATA KEIICHI
Application Number:
JP2019199340A
Publication Date:
May 06, 2021
Filing Date:
October 31, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/11; C08G8/04; C08G12/26; G03F7/26; H01L21/027
Attorney, Agent or Firm:
Sumio Tanai
Matsumoto
Ryu Miyamoto
Masato Iida