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Title:
HARD AND TOUGH POLYAMIDE COMPOSITION
Document Type and Number:
Japanese Patent JPS6253372
Kind Code:
A
Abstract:
Rigid, high-impact polyamide moulding compositions contain A from 20 to 90 parts by weight of at least one linear thermoplastic polyamide, B from 5 to 30 parts by weight of at least one rubber-elastic polymer which contains carboxyl groups and/or latent carboxyl groups and/or acid anhydride and/or alkyl(meth)acrylate and/or acid amide groups and has a glass transition temperature of below -30 DEG C, C from 5 to 30 parts by weight of plate-form, natural graphite having a mean particle size of from 0.1 to 20 mu m, the sum of the parts by weight of A, B and C in each case adding up to 100 parts by weight, and D if desired additives in effective amounts. i

Inventors:
EERUHARUTO ZAIRAA
GURAHAMU EDOMUNTO MATSUKU KEE
RAINAA TEIZOON
Application Number:
JP19301586A
Publication Date:
March 09, 1987
Filing Date:
August 20, 1986
Export Citation:
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Assignee:
BASF AG
International Classes:
C08L23/08; C08K3/04; C08L7/00; C08L21/00; C08L23/00; C08L33/00; C08L33/02; C08L51/00; C08L51/02; C08L77/00; C08L101/00; (IPC1-7): C08K3/04; C08L23/08; C08L33/04; C08L77/00



 
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