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Title:
HEAD POLISHING DEVICE AND HEAD POLISHING METHOD
Document Type and Number:
Japanese Patent JP2002103203
Kind Code:
A
Abstract:

To uniformly polish each of head elements more efficiently with a high degree of accuracy.

In this head polishing device and head polishing method, the plural head elements arranged with a predetermined pattern on a same plane are brought into contact with a rotating lapping machine, thereby carrying out polishing of all the head elements. In this device and method, each of the head elements is held in a holding means while maintaining the predetermined pattern, and after starting of polishing, it is determined whether or not a difference between the head elements respectively arranged at one end and the other end of the holding means is more than a predetermined value, and based on the determined result, a control is performed such that an amount pressurized in a direction adjacent to the lapping machine with respect to one end or the other end of the holding means is increased or decreased, or such that the amount pressurized in the direction adjacent to the lapping machine with respect to one end or the other end of the holding means is stopped.


Inventors:
AIZAWA MAKOTO
Application Number:
JP2000306633A
Publication Date:
April 09, 2002
Filing Date:
October 02, 2000
Export Citation:
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Assignee:
SONY CORP
International Classes:
B24B37/005; (IPC1-7): B24B37/00
Domestic Patent References:
JPH0453672A1992-02-21
JP2000117617A2000-04-25
JPH0970750A1997-03-18
JPH11300607A1999-11-02
Attorney, Agent or Firm:
Kei Tanabe