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Title:
HEAT CONDUCTIVE GREASE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
Japanese Patent JP3948642
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a soft heat conductive grease composition which are excellent in heat conductivity and dispensation properties and do not mar silicon surfaces, and high performance semiconductor device capable of preventing heat build-up electronic parts from overheating.
SOLUTION: A heat conductive grease composition comprises (A) 100 pts.wt. at least one base oil selected from a liquid silicone oil, a liquid hydrocarbon oil and a fluorinated hydrocarbon oil and (B) 500-1,200 pts.wt. metallic aluminum powder having an average particle diameter of 0.5-50 μm which is a mixture of a fine powder having an average particle diameter of 0.5-5 μm and a coarse powder having an average particle diameter of 10-40 μm at a ratio of 9/1-1/9.


Inventors:
Takayuki Takahashi
Kunihiro Yamada
Kenichi Isobe
Application Number:
JP23573198A
Publication Date:
July 25, 2007
Filing Date:
August 21, 1998
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/04; C10M105/04; C08K3/08; C08K3/22; C08K3/38; C08K9/06; C08K13/06; C10M105/54; C10M107/50; C10M113/00; C10M113/06; C10M113/08; C10M169/00; C10M169/02; H01L23/373; C10N10/04; C10N10/06; C10N20/02; C10N20/06; C10N30/08; C10N40/06; C10N40/14; C10N50/10; (IPC1-7): C10M169/02; C10M105/04; C10M105/54; C10M107/50; C10M113/00; C10M113/06; C10M113/08; H01L23/373; //C10N10:04; C10N10:06; C10N20:02; C10N20:06; C10N30:08; C10N40:06; C10N40:14; C10N50:10
Domestic Patent References:
JP3106996A
JP1242693A
JP50134006A
JP10110179A
JP3162493A
JP4202496A
JP4164995A
JP7211825A
Attorney, Agent or Firm:
Kiyoaki Takita