Title:
HEAT CONDUCTIVE SHEET AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021005595
Kind Code:
A
Abstract:
To provide a thin film heat conductive sheet having excellent heat conductivity.SOLUTION: In a heat conductive sheet including a resin and a heat conductive filler, the heat conductivity in the thickness direction is 15 W/m K or more, the content ratio of the heat conductive filler is 30 volume% or more, and the average thickness is 30 μm or more and 100 μm or less.SELECTED DRAWING: Figure 1
Inventors:
KOJIMA MASAZUMI
MATSUSHITA MIZUKI
MATSUSHITA MIZUKI
Application Number:
JP2019117442A
Publication Date:
January 14, 2021
Filing Date:
June 25, 2019
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
H01L23/36; B29D7/01; C08J5/18; H05K7/20
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Yuta Terashima
Rintaro Takahashi
Mitsutsugu Sugimura
Yuta Terashima
Rintaro Takahashi