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Patent Searching and Data


Title:
HEAT PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2023131254
Kind Code:
A
Abstract:
To provide a heat processing device that can prevent the temperature of a light emitting element from rising and efficiently heat a substrate.SOLUTION: A heat processing device 1 heats a semiconductor wafer W by irradiating the semiconductor wafer W with light. The heat processing device 1 includes a chamber 6 that accommodates the semiconductor wafer W, a plurality of LED lamps 45 that emit light, and a plurality of optical fibers 46 that are respectively connected to the plurality of LED lamps 45. Furthermore, in the heat processing device 1, one end of each of the plurality of optical fibers 46 is connected to the LED lamp 45, and the other end of the plurality of optical fibers 46 is arranged in a plane to form a light emitting surface 47.SELECTED DRAWING: Figure 1

Inventors:
YAMADA TAKAYASU
Application Number:
JP2022035881A
Publication Date:
September 22, 2023
Filing Date:
March 09, 2022
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/26
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita