Title:
HEAT SINK DEVICE
Document Type and Number:
Japanese Patent JP2001102509
Kind Code:
A
Abstract:
To provide a new and improved heat sink device of high performance at a low cost.
A heat-conductive sheet 22 where a protruding streak 24 and a recess 26 are alternately folded, forming separate fins 28 comprising both edges 30 and 32, constitutes a heat exchange part 18. The folded heat-conductive sheet 22 is formed into a cylinder, and the recess 26 forms a segmented inside cylinder 34, while the protruding streak 24 forms segmented outside cylinder 36 concentric with the inside cylinder 34, and constituting the heat exchange part, with a heat-conductive rod 40 in the segmented inside cylinder 34 formed by the recess 26 provided.
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Inventors:
BAMFORD WILLIAM C
BRAIN C WATLING
WYLER GREGORY T
BRAIN C WATLING
WYLER GREGORY T
Application Number:
JP2000260340A
Publication Date:
April 13, 2001
Filing Date:
August 30, 2000
Export Citation:
Assignee:
MOLEX INC
International Classes:
H01L23/36; H01L23/367; H01L23/427; H01L23/467; (IPC1-7): H01L23/467
Attorney, Agent or Firm:
Hiroshi Ikeda