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Title:
HEAT STORAGE LAMINATE
Document Type and Number:
Japanese Patent JP2010249506
Kind Code:
A
Abstract:

To provide a heat storage laminate attaining energy saving in a living space of a housing environment or the like.

The heat storage laminate is formed by sequentially laminating a high heat conductivity layer 2 (aluminum can be suitably used) having a heat conductivity of 10.0 W/(m K) or higher, a heat storage layer 3 (an inorganic latent heat storage material and an organic latent heat storage material) comprising a heat storage material filled in a urethane resin porous body, a low heat conductivity layer 4 having a heat conductivity of 0.1-1.0 W/(m K), a slate plate, a gypsum board, an ALC plate, a cemented excelsior board, etc.


Inventors:
AMANO RYOTARO
Application Number:
JP2010000094963
Publication Date:
November 04, 2010
Filing Date:
April 16, 2010
Export Citation:
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Assignee:
SK KAKEN CO LTD
International Classes:
F28D20/00; E04B1/74
Domestic Patent References:
JPH10311693A1998-11-24
JP2001081446A2001-03-27
JPH0388643A1991-04-15
JPH06235592A1994-08-23
JPH02101392A1990-04-13
JPS5642098A1981-04-20
JPH01167537A1989-07-03
JPH09174741A1997-07-08
JPH0961078A1997-03-07
JP2003306672A2003-10-31