Title:
HEAT TREATMENT APPARATUS FOR SUBSTRATE
Document Type and Number:
Japanese Patent JP3904195
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus for a substrate capable of easy replacement of a pin and easy adjusting of protrusion height of the pin from a hot plate heating surface, while a synthetic resin material is used for the pin that supports the substrate to keep a prescribed distance from the hot plate heating surface.
SOLUTION: Related to a heat treatment apparatus 1, a hot plate 2 is provided with multiple pins 9 which protrude from a heating surface 2a of the hot plate 2, and a substrate 4 so supported by the pins 9 as to keep a prescribed interval from the heating surface 2a of the hot plate 2 and heated by the hot plate 2. The pin 9 is made of synthetic resin material and screwed into the hot plate 2 from above the heating surface 2a of the hot plate 2. The central section of the top face of the pin 9 is a convex part 9b, with a groove 9c in which a rotary jig is inserted being formed symmetrically relative to the convex part 9b. A compression spring 10 is interposed between the pin 9 and the hot plate 2 to prevent the loosening of coupling with a screw between them.
Inventors:
Makoto Fujiyoshi
Application Number:
JP2001382424A
Publication Date:
April 11, 2007
Filing Date:
December 17, 2001
Export Citation:
Assignee:
Hirata Kiko Co., Ltd.
International Classes:
F27D11/02; H01L21/027; (IPC1-7): H01L21/027; F27D11/02
Domestic Patent References:
| JP8124818A |
Attorney, Agent or Firm:
Inoue Motohiro